Rochester Electronics ADG782BCP-REEL7 Mfr Package Description: 4 X 4 MM, CSP-20 Technology: CMOS Package Shape: SQUARE Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Surface Mount: Yes Terminal Form: NO LEAD Terminal Pitch: 0.5000 mm Terminal Finish: TIN LEAD Terminal Position: QUAD Number of Functions: 4 Number of Terminals: 20 Package Body Material: UNSPECIFIED Temperature Grade: INDUSTRIAL Number of Inputs: 1 Switch-on Time-Max: 20 ns Switch-off Time-Max: 12 ns Analog IC - Other Type: SGL POLE SGL THROW SWITCH Off-state Isolation-Nom: 58 dB Analog Input Voltage Limit-Max: 3 V Operating Temperature-Max: 85 Cel Operating Temperature-Min: -40 Cel Supply Voltage-Max (Vsup): 5.5 V Supply Voltage-Min (Vsup): 1.8 V Supply Voltage-Nom (Vsup): 3 V On-state Resistance Match-Nom: 0.1000 ohm On-state Resistance-Max (Ron): 10 ohm